Thermally Conductive Flame-Retardant Potting Compound for PCB Boards Electronic Controllers

Product Details
Customization: Available
CAS No.: 9009-54-5
EINECS: 210-898-8
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Management System Certification
ISO 9001, ISO 9000, ISO 14001, ISO 14000, OHSAS/ OHSMS 18001, IATF16949, HSE, ISO 14064, QC 080000, GMP, BSCI, BRC, SA 8000, QHSE, HACCP, BS 25999-2, SEDEX, ISO 22000, AIB, WRAP, GAP, IFS, PAS 28000
Export Year
2011-02-02
OEM/ODM Availability
Yes
  • Thermally Conductive Flame-Retardant Potting Compound for PCB Boards Electronic Controllers
  • Thermally Conductive Flame-Retardant Potting Compound for PCB Boards Electronic Controllers
  • Thermally Conductive Flame-Retardant Potting Compound for PCB Boards Electronic Controllers
  • Thermally Conductive Flame-Retardant Potting Compound for PCB Boards Electronic Controllers
  • Thermally Conductive Flame-Retardant Potting Compound for PCB Boards Electronic Controllers
  • Thermally Conductive Flame-Retardant Potting Compound for PCB Boards Electronic Controllers
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  • Overview
  • Product Description
  • Product Parameters
  • Certifications
  • Packaging & Shipping
  • Company Profile
  • After Sales Service
Overview

Basic Info.

Model NO.
SP291
Bonding Function
Potting Glue
Morphology
Solid-State
Application
Electronic Circuit Boards (PCB Boards)
Material
Polyurethane
Classification
Potting Adhesive
Main Agent Composition
Polyurethane Elastomer
Characteristic
1.Low Hardness, Good Toughness, Excellent Earthqua
Promoter Composition
Curing Agent
Composition
Organic Material
Color
Black Liquid, Light Yellow Liquid
Transport Package
Part a: 27 Kg Part B: 27 Kg
Specification
Part A: 27 kg Part B: 27 kg
Trademark
SEPNA
Origin
China
HS Code
35069900

Product Description


Thermally Conductive Flame-Retardant Potting Compound for PCB Boards Electronic Controllers
Thermally Conductive Flame-Retardant Potting Compound for PCB Boards Electronic Controllers
Thermally Conductive Flame-Retardant Potting Compound for PCB Boards Electronic Controllers

Product Description

SP291 is a two-component polyurethane potting compound, the A component contains hydroxyl groups, and the B component is based on isocyanate. After A and B are mixed, they will form an elastomer after curing, and the volume will not change significantly.

Key Features:
1. Low hardness, good elasticity, excellent earthquake resistance;
2. Good sealing, waterproof and shockproof effect;
3. The product can be cured between 15-65 degrees without bubbles.
4. Excellent electrical insulation, flame retardant grade UL94 V-0, peelable and easy to repair

Typical Applications:
1. Electronic circuit board (PCB);
2. Electronic and electrical controller;
3. IGBT potting, new energy vehicle electrical controller potting, etc.
4. It can be used for filling, coating, casting, metal and plastic bonding well.
5. Used in communication equipment, transformers, control power supplies, ignition controllers, electronic sensors, etc.
6. Suitable for charging pile potting.

Packing and Storage:

Part A: 27 kg
Part B: 27 kg
Storage period: Part: 12 months; Part B: 9 months (sealed and unopened).

Product Parameters

PROPERTY STANDARD VALUE-SP291
Component -- Part A Part B

Appearance

Visual
Black liquid Light yellow liquid
Viscosity /mPa.s GB/T 10247-2008 20000-30000 3000-6000
Viscosity after mixing/mPa.s GB/T 10247-2008 10000-20000
Density/g/cm³ GB/T 15223-1994 1.40±0.05 1.40±0.05
Data details after mixing
Mixture ratio Mass ratio
A:B=100:100
Operating time after mixing GB/T10247-2008 15-30 min
Gel time 25ºC/50% GB/T10247-2008 60min(Time adjustable)
Hardness/Shore D GB/T521-2008 30-40
Tensile strength MPa GB/T 528-2009 >8
Elongation at break/% GB/T 528-2009 >100
Shear strength/MPa GB/T 528-2009 >AI-AI
Flame retardant grade /UL94 ANSI/UL-94-1985 V-0
Thermal conductivity/w/m.k GB/T10297-1998 0.70
Dielectricconstant 50Hz,25ºC GB/T1693-2007 3.35
Loss coefficient 50Hz,25ºC GB/T1693-2007 0.02
Volume resistivity /Q.cm GB/T 1692-92 >1014
Water absorptionrate AIINF0   0/ GB/T8810-2005 <0.15
Glass transition temperature Tg (ºC) GBT 11998-1989 10
Expansion coefficient um/m · ºC GBT 20673-2006 140

Operating temperature range
GB/T20028-2005
-40ºC-125ºC
Note:The  above  data  are  all  detection  data  in  standard  state.

Certifications

 
Thermally Conductive Flame-Retardant Potting Compound for PCB Boards Electronic Controllers
Thermally Conductive Flame-Retardant Potting Compound for PCB Boards Electronic Controllers
Thermally Conductive Flame-Retardant Potting Compound for PCB Boards Electronic Controllers
Thermally Conductive Flame-Retardant Potting Compound for PCB Boards Electronic Controllers
Thermally Conductive Flame-Retardant Potting Compound for PCB Boards Electronic Controllers
Thermally Conductive Flame-Retardant Potting Compound for PCB Boards Electronic Controllers

 

Packaging & Shipping

Thermally Conductive Flame-Retardant Potting Compound for PCB Boards Electronic Controllers
Thermally Conductive Flame-Retardant Potting Compound for PCB Boards Electronic Controllers
Thermally Conductive Flame-Retardant Potting Compound for PCB Boards Electronic Controllers
Thermally Conductive Flame-Retardant Potting Compound for PCB Boards Electronic Controllers

 

Company Profile

Thermally Conductive Flame-Retardant Potting Compound for PCB Boards Electronic Controllers
Thermally Conductive Flame-Retardant Potting Compound for PCB Boards Electronic Controllers
Thermally Conductive Flame-Retardant Potting Compound for PCB Boards Electronic Controllers
Thermally Conductive Flame-Retardant Potting Compound for PCB Boards Electronic Controllers
Thermally Conductive Flame-Retardant Potting Compound for PCB Boards Electronic Controllers
Thermally Conductive Flame-Retardant Potting Compound for PCB Boards Electronic Controllers


SEPNA focuses on the R&D and production of advanced new materials. Headquartered in Shanghai, the factory is located in Qidong  High-tech  Zone,  Jiangsu  Province.  It is a modern technology factory with an area of 20000 square meters.

SEPNA factory uses advanced MES automatic quality control system and full-process ERP management system for strict quality  control. SEPNA factory and products have passed many international system certifications. Such as ISO9001-2015, SGS, 16949 and other certificates.

SEPNA  adheres  to  the  values  of  "customer-centric,  take  technology as the blood, and focus on high-quality", adhere to  the development concept of "DEVELOP DEPEND ON THE  TECHNICAL INNOVATION, LIVE DEPEND ON THE QUALI-  TY,"; Focus on providing customers with more accurate and  safe products with "bonding, sealing and protection" functions.

SEPNA product lines, from flexible sealing, fixed bonding to the development of multiple curing forms products, can fully match the production and manufacturing processes of differ- ent customers, and SEPNA can provide all customers with more  options,  higher  efficiency  and  better  quality  product solutions, as well as omni-directional customized services and support.

SEPNA closely connects customers/suppliers/employ- ees/partners with the mission of "Zero-SL Bonds Us Together! ". And continues to promote technology and product innova- tion, service innovation, and talent innovation, better combine the value of products, services, and talents to make products more perfect, make industrial manufacturing more efficient, and to provide more valuable products and service solutions for the high-end and high-end manufacturing industry!

 

After Sales Service

All product properties and application details based on information believe to be reliable and accurate. But you still need to test its property and safety before application. The advices we supply don't apply in any circumstances. SEPNA  don't  make  assurance  of  any  other  applications  outside  the  specification  until SEPNA supply a special written guarantee. SEPNA is only responsible to replace or refund if this product is defective within the warranty period stated above. SEPNA makes it clear that will not be liable of any accidents.

If you meet any problem about products,you  can feel free to contact us.

Thermally Conductive Flame-Retardant Potting Compound for PCB Boards Electronic Controllers

Thermally Conductive Flame-Retardant Potting Compound for PCB Boards Electronic Controllers

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