Solder Joint Thermal Curing Adhesive Sealant

Product Details
Customization: Available
CAS No.: 9009-54-5
Formula: CH3h8n2o
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Management System Certification
ISO 9001, ISO 9000, ISO 14001, ISO 14000, OHSAS/ OHSMS 18001, IATF16949, HSE, ISO 14064, QC 080000, GMP, BSCI, BRC, SA 8000, QHSE, HACCP, BS 25999-2, SEDEX, ISO 22000, AIB, WRAP, GAP, IFS, PAS 28000
Export Year
2011-02-02
OEM/ODM Availability
Yes
  • Solder Joint Thermal Curing Adhesive Sealant
  • Solder Joint Thermal Curing Adhesive Sealant
  • Solder Joint Thermal Curing Adhesive Sealant
  • Solder Joint Thermal Curing Adhesive Sealant
  • Solder Joint Thermal Curing Adhesive Sealant
  • Solder Joint Thermal Curing Adhesive Sealant
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  • Overview
  • Product Description
  • Product advantages
  • Typical Applications
  • Technical Data Sheet
  • Application Process
  • Company Profile
  • Why Choose Us
  • Our customers and Exhibition
Overview

Basic Info.

Model NO.
S857
EINECS
210-898-8
Bonding Function
High Temperature Resistant Adhesive
Morphology
Paste
Application
Automobile, Construction
Material
Acrylic
Classification
Single Component
Main Agent Composition
Acrylic Polyurethane/Epoxy
Composition
Acrylic Polyurethane/Epoxy
Color
White
Shelf Life
9 Months
Transport Package
Air, Sea, Road and Railway.
Specification
310ml
Trademark
Sepna
Origin
China
HS Code
3506100090
Production Capacity
100000kg

Product Description

Solder Joint Thermal Curing Adhesive SealantProduct Description
high temperature welding adhesive sealant

Product Description

 

S857 
 
High temperature sealant
Solder Joint Thermal Curing Adhesive Sealant
S857 is also well suited for sealing applications on E-coated metals prior to subsequent paint processes (including powder coating processes).

S857  is designed as an adhesive/sealant. As an adhesive, it is usually used in combination with spot welding, riveting, clinching, and other mechanical fastening techniques to fix the parts until the curing process is completed. Bonding of oily substrates is possible up to an oil amount of 3 g/m2.

This product is suitable for professional experienced users only.
Tests with actual substrates and conditions have to be performed to ensure adhesion and material compatibility.
 
Solder Joint Thermal Curing Adhesive Sealant
S857 is a one-component solvent-free heat-curing sealant based on
PVC/ acrylate.
 
S857 is cured by heat Curing depends both on temperature and elapsed time. The most suitable heat sources are convection ovens.
 
The minimum heating temperature is 175°C (347°F), while the maximum temperature must not exceed 230°C (446°F). It is
mandatory to perform tests with original parts to ensure proper curing and function of the bonded part under original conditions
For further information contact the Technical Service Department of SEPNA Industry.

Product advantages

 

S857 
 
230ºC/446ºF 
Heat curing
 
High-temperature resistance of
 
(180-230°C/356-446ºF),
no aging and discoloration
 
 
Suitable for powder-coating processes
 
 
 
Adheres well to most E-coated substrates and oily metal substrates.

 
 
It has very good bonding strength.
 
Eco-friendly, PVC free
 
Good tooling properties
 
Spot welding is still possible

Does not contain solvents or PVC
Solder Joint Thermal Curing Adhesive Sealant

Typical Applications

Solder Joint Thermal Curing Adhesive Sealant
Solder Joint Thermal Curing Adhesive Sealant

 

                          Suitable for powder-coating processes Matching powder paint
  
1. Used for clean metal or electro coat prior to powder coat.
2. For bonding clean the steel plate.
3. For bonding clean electrophoresis plates.
4. For sealing welds in the body.
5. For sealing welds outside the body.
6. It is used for sealing, waterproofing, dustproof, and anti-corrosion of the vehicle body.
 

Technical Data Sheet

PROPERTY
STANDARD/UNITS
VALUE-S857
Appearance
Visual inspection
White, homogeneous paste
Solids
%
>99
Pressure flow viscosity
25ºC,Φ0.1mm,0.4MPa
7-20g/20s
Adhesion force
80ºC*30min
Excellent
Heat Resistance
200ºC*1h
Excellent
Hardness
Shore A
>20
Curing speed
>175ºC
30 min
Construction temperature
ºC
15-25
Shelf life
Month
≥9

Application Process


Cure Mechanism
S857 is cured by heat. Curing depends both on temperature and elapsed time. The most suitable heat sources are convection ovens. The minimum heating temperature is 180°C (356°F), while the maximum temperature must not exceed 230°C (446°F). It is mandatory to perform tests with original parts to ensure proper curing and function of the bonded part under original conditions. For further information contact the Technical Service Department of SEPNA Industry.
 
Method of Application
In order to obtain the best strength, the following curing conditions should be followed: >175ºC(347°F)*30 min. Different curing conditions will lead to changes in shear strength.
 
Unpacks: S855 can be applied with electric or pneumatic-driven piston-operated guns. Drums: Dispensing from drums requires the use of standard hydraulic or pneumatic drive pumping equipment. For advice on selecting and setting up a suitable pump system, contact the System Engineering Department of the SEPNA Industry.

PACKING AND STORAGE
 
Package specification:
 
310ml/cartridge, 20 cartridge/ box
230kg/ bucket
Storage:

is recommended to store in an environment with a temperature
of 5~25 ºC(41°F-77°F).
Transportation:
 
moisture-proof, rainproof, sunproof, high-temperature roof, keep away
p from heat sources, handle with care and do not squeeze or collide
 
 
 

Company Profile

Solder Joint Thermal Curing Adhesive Sealant
SEPNA focuses on the R&D and production of advanced new materials. Headquartered in Shanghai, the factory is located in Qidong High-tech Zone, Jiangsu Province. It is a modern technology factory with an area of 20000 square meters.

SEPNA factory uses an advanced MES automatic quality control system and a full-process ERP management system for strict quality control.

SEPNA factory and products have passed many international system certifications. Such as ISO9001-2015, SGS, 16949, and other certificates.

SEPNA adheres to the values of being "customer-centric, take technology as the blood, and focus on high-quality", adheres to the development concept of "DEVELOP DEPEND ON THE TECHNICAL INNOVATION, LIVE DEPEND ON THE QUALITY,"; Focus on providing customers with more accurate and safe products with "bonding, sealing and protection" functions.

SEPNA product lines, from flexible sealing, and fixed bonding to the development of multiple curing forms products, can fully match the production and manufacturing processes of different customers, and SEPNA can provide all customers with more options, higher efficiency, and better quality product solutions, as well as omnidirectional customized services and support.

 

SEPNA closely connects customers/suppliers/employees/partners with the mission of "Zero SL Bonds Us Together! ". And continues to promote technology and product innovation, service innovation, and talent innovation, better combine the value of products, services, and talents to make products more perfect, make industrial manufacturing more efficient, and provide more valuable products and service solutions for the high-end and high-end manufacturing industry!

 

Why Choose Us

1. Outstanding manufacturers and powerful factories.
2. OEM / ODM AVAILABLE (Professional design team providing package design solutions for OEM / ODM customers free of charge.
3. Free Samples.
4. Imported Raw Materials and Test Equipment.
5. Strict quality control (We have passed GB/T 19001-2016, IS09001:2015, and IATF 16949:2016 quality system authentication, and we can provide ROHS/SGS/ MSDS certification of products).
6. Deliver in 7-15 Days after payment.
7. Excellent QC Team and R&D Team.
8. Provide professional application technology solutions.
9. Complete the after-sales service system.
10. Partners with Top 500 Global Companies.

Sepna's products have been widely used in the international market, mainly in North America, South America, Asia, Southeast Asia the Middle East, Oceania, etc.

Until now, she has serviced nearly 1000 enterprises all over the world.
 

Our customers and Exhibition

Solder Joint Thermal Curing Adhesive Sealant


Certification
Solder Joint Thermal Curing Adhesive SealantSolder Joint Thermal Curing Adhesive Sealant

About Transportation

Samples: Express ( FedEx, DHL, TNT, UPS, etc.)
Cargo: By Sea ( FCL / LCL), By Air, By Railway, By truck, etc.

Solder Joint Thermal Curing Adhesive Sealant
FAQ:
Q1. How to get an accurate quotation from us?
A1. Please provide your requirements, product specifications, quantity, and trade terms.


Q2. Can you provide OEM service?
A2.Yes.Private labeling service is available

Q3. How to be SEPNA'S distributor?
A3.As the growing of Sepna's global business, we need to find more and more distributors and agents
worldwide. SEPNA will provide the best solution and service for our partners.

For more information, pls contact our salesperson or call us:+86-400-882-1323

Q4. Can I get a sample?
A4. Yes. We offer free samples

Q5. What is your product's shelf life?
A5.9 months when stored in cool dry and well-ventilated areas under 25ºC.
Solder Joint Thermal Curing Adhesive Sealant

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