Customization: | Available |
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CAS No.: | 9009-54-5 |
Formula: | CH3h8n2o |
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SE685 is a solvent-free, black, two-component epoxy potting adhesive that can be cured at room temperature or by heating.
It has low heat emission, low shrinkage and good thermal conductivity when curing.
After curing, it has excellent electrical, mechanical and impact resistance properties, and can be applied to sample parts that need to be fully enclosed and protected, such as transformers,electronic stators, ignition coils, etc
Key Features:
Typical Applications:
1.Applicable to the sample parts that need full enclosed protection, such as transformer, electronic stator, ignition coil, etc.
2.Suitable for motor, automotive electronics, power tools, reactors, instruments and other encapsulation protection, with excellent adhesion and temperature resistance to most plastic and metal substrates.
PROPERTY | STANDARD | VALUE of SE685 | |
---- | ---- | PARTA | PARTB |
Appearance | Visual inspection | Black viscous liquid | Clear liquid |
Viscosity/25ºC,cps |
GB/T 10247-2008 |
20,000±10,000 | 20-10 |
Density /25ºC,g/cm3 | GB/T 13354-92 | 1.70±0.1 | 1.0±0.1 |
Data details of after mixing | ||
Mixture ratio | Mass ratio | A:B=100:13 |
Viscosity of mixture/25ºC,cps |
GB/T 10247-2008 |
2000±1000 |
Density of mixture/25ºC,g/cm3 | GB/T 13354-92 | 1.6±0.1 |
Operation time/25ºC,hr | GB/T13477-2002 | (226g)35±10 |
Gel time/25°C,hr | GB/T13477-2002 | 10~12 |
Hardness/Shore D | GB/T 531.1-2008 | 85±5 |
Tensile shear Strength /N/mm² |
GB/T7124-2008 |
AI-AI 12 |
Stainless steel/stainless steel 13 |
||
Glass transition temperature Tg | GBT11998-1989 | 50-60ºC |
Coefficient of linear expansion/10-6/k |
GB/T7124-2008 |
38,<Tg |
115,>Tg | ||
Flame retardant grade | ANSI/UL-94-1985 | UL94V-0 |
Thermal conductivity/W/mK | GB/T10297-1998 | 0.9-1.0 |
Water absorption rate |
GB/T 8810-2005 | 24H,25ºC,0.1% |
GB/T 8810-2005 | 2H,100ºC,0.6% | |
Volume resistivity/9 ·cm |
GB/T1692-92 |
3.4*10¹4 |
Dielectric strength/kV/mm,25ºC | GB/T 1693-2007 | >17 |
Dielectric constant/1.2MHz,25ºC | GB/T 1693-2007 | 3-5 |
Loss factor/1MHz,25ºC | GB/T 1693-2007 | 0-1 |
Thermal shock test(500 cycles) | ---- | -40~150ºC |
Operating temperature | ºC | -50-150 |
Shelf life |
Component A | 12 months |
Component B | 12 months | |
Resistant to the following media:water,acid and alkali(PH3-10),hydrocarbon,brine. Not resistant to the following media:polar solvents,strong acids and bases. |