Thermally Conductive Flame Retardant Epoxy Potting Compound
Thermally Conductive Flame Retardant Epoxy Potting Compound
SE685 (1.0 W/m.k)
SE686 (1.5 W/m.k)
SE685/SE686 are solvent-free, two-component epoxy potting adhesive that can be cured at room temperature or by heating. This product has low heat release during curing, low shrinkage, good thermal conductivity, and excellent electrical, mechanical and impact resistance after curing.
SPECIAL CHARACTERISTICS
1. Suitable for samples that require fully enclosed protection, such as transformers, electronic stators, ignition coils, etc.;
2. Suitable for packaging protection of motors, automotive electronics, power tools, reactors, instruments, etc.;
3. Excellent adhesion and temperature resistance to most plastic and metal substrates.
APPLICATION EXAMPLES
PROPERTY |
STANDARD |
UNITS |
VALUE-SE685/SE686 |
Component |
- |
-- |
Part A |
Part B |
Appearance |
Visual |
|
Black liquid |
Transparent liquid |
Viscosity |
GB/T 10247-2008 |
mPa.s |
20000/40000 |
200/30 |
Density |
GB/T 13354-92 |
g/cm^3 |
1.7±0.05 |
1.0±0.05 |
Data details after mixing |
Mixture ratio |
- |
Mass ratio |
A:B=100:15 / A:B=100:16 |
Mixing viscosity |
GB/T 10247-2008 |
mPa.s |
1700/4700 |
Solid content |
GB-T 2793-1995 |
% |
>99 |
Operation time after mixing |
GB/T 10247-2008 |
min |
25±5 |
Tack free time |
|
Min 25ºC/50% |
50±10 |
Gel time |
GB/T 10247-2008 |
Min 25ºC/50% |
40 |
Curing speed |
GB/T 10247-2008 |
100g (plastic cup) /65 ºC |
30min |
Hardness |
GB/T 531.1-2008 |
Shore D |
85±5 |
Tensile strength |
GB/T 528-2009 |
Mpa |
>4 |
Flame retardant grade |
ANSI/UL-94-1985 |
UL94 |
V-0 |
Thermal conductivity |
GB/T 10297-1998 |
W/m.k |
1.0 / 1.5 |
Elongation at break |
GB/T 528-2009 > |
% |
≥60 |
CTI value |
GB/T 4207-2012 |
- |
≥600 |
Dielectric strength |
GB/T 1693-2007 |
kV / mm |
> 20 |
Dielectric constant |
GB/T 1693-2007 |
- |
4.64 |
Dielectric loss coefficient 100kHz |
GB/T 1693-2007 |
100kHz |
0.1 |
Volume resistivity |
GB/T 1692-92 |
Ω • cm |
3.7 ×1015 |
Water absorption |
GB/T 8810-2005 |
24h, 25 ºC,% |
24h/23ºC 0.12% 10d/23ºC 0.21% 0.5h/100ºC 0.09% |
Application temperature |
GB/T 8810-2005 |
ºC |
-50-150ºC |
Shanghai Sepna Chemical Technology Co., Ltd is special for Polyurethane sealant MS polymer adhesive sealant for automotive glass, bus, and construction joint sealing, bonding. We have been 10+ years in this industry, acquired Switzerland PUNADE in 2005, as the leader of odorless technology in China. With Suzhou, Shanghai has two R&D bases.
At the same time. we have established an excellent sales service team and cooperated with the leading industry of VW, Volvo, Mercedes, Brilliance, Etc. Sepna's products have been widely used in the international market, mainly in North America, South America, Asia, Southeast Asia Middle East and Oceania, etc. Until now, she has serviced nearly 1000 enterprises all over the world.
APPLICATION SOLUTIONS:
1. Windshield sealant- SP86x
2. Automotive adhesive sealant-
-PU structural adhesive
-MS adhesive sealant
3. Electronic potting sealant
4. Powder coating sealant
5. Window & Door corner adhesive
6. Waterproofing coating
7. Expansion joint sealant
- Self-leveling sealant
- Paste sealant
Part A: 25kg/pail
Part B: 6kg/pail
Mixing ratio: 100:15 by weight
1.Delivery time ?
Normally, delivery time of sample order is 3 to 7 days, standard order is 7-20 days.
2.How to get free samples ?
Contact with us to get free samples
3.How to be Sepna's distributor ?
As the growing of Sepna's global business,we need to find more and more distributors and agents worldwide. Sepna will provide the best solution and service for our partners. For more information, pls contact with us directly
4.Any OEM/ODM service ?
Sepna can offer the customer OEM label service,and will give the protection of the your right in your market.