Se685 25kg 100: 15 2K Epoxy Potting Adhesive for Automotive Electronic Module

Product Details
Customization: Available
CAS No.: 9009-54-5
Formula: CH3h8n2o
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Management System Certification
ISO 9001, ISO 9000, ISO 14001, ISO 14000, OHSAS/ OHSMS 18001, IATF16949, HSE, ISO 14064, QC 080000, GMP, BSCI, BRC, SA 8000, QHSE, HACCP, BS 25999-2, SEDEX, ISO 22000, AIB, WRAP, GAP, IFS, PAS 28000
Export Year
2011-02-02
OEM/ODM Availability
Yes
  • Se685 25kg 100: 15 2K Epoxy Potting Adhesive for Automotive Electronic Module
  • Se685 25kg 100: 15 2K Epoxy Potting Adhesive for Automotive Electronic Module
  • Se685 25kg 100: 15 2K Epoxy Potting Adhesive for Automotive Electronic Module
  • Se685 25kg 100: 15 2K Epoxy Potting Adhesive for Automotive Electronic Module
  • Se685 25kg 100: 15 2K Epoxy Potting Adhesive for Automotive Electronic Module
  • Se685 25kg 100: 15 2K Epoxy Potting Adhesive for Automotive Electronic Module
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Basic Info.

Model NO.
SE685
Bonding Function
Structural Adhesive
Application
Automobile, Construction
Material
Epoxy
Color
Black
Type
Two-Component
Main Raw Material
Epoxy Adhesive
Advantage
High Bond Strength and Sealing
Usage
Transformer, Electronic Stator, Ignition Coil, etc
OEM/ODM
Free OEM&ODM Service
Shelf Life
9 Months
Hardness
Shore D 85
Flame Retardant Grade
UL94 V-0
Dielectric Strength
More Than 17 Kv Per mm
Thermal Conductivity
1.0
Applications
Motor, Automotive Electronics, Power Tools
Transport Package
Air, Sea, Road and Railway.
Specification
25KG per bucket
Trademark
SEPNA
Origin
China
HS Code
35069900
Production Capacity
1000000000

Product Description

Our products



Se685 25kg 100: 15 2K Epoxy Potting Adhesive for Automotive Electronic Module

SE685 is a solvent-free, black,

Two-component epoxy potting resin adhesive

It can be cured at room temperature or by heating.

After curing, it has excellent electrical, mechanical, and impact resistance properties. It can be applied to sample parts that must be fully enclosed and protected, such as transformers, electronic stators, ignition coils, etc.
Se685 25kg 100: 15 2K Epoxy Potting Adhesive for Automotive Electronic Module

Se685 25KG 100:15 2K Epoxy Potting Adhesive for Automotive Electronic Module

 
Mixture ratio: AB=100:15 (Mass ratio)

It has low heat emission, shrinkage, and good thermal conductivity when curing.
 
Se685 25kg 100: 15 2K Epoxy Potting Adhesive for Automotive Electronic Module
Special features
 
 
Se685 25kg 100: 15 2K Epoxy Potting Adhesive for Automotive Electronic Module
1. Excellent capricious and anti-impact resistance.
2. Excellent mechanical properties and electrical properties.
3. Excellent electrical insulation, and thermal stability.
4. Flame retardant UL94 V-0.
 
Se685 25kg 100: 15 2K Epoxy Potting Adhesive for Automotive Electronic Module
5. Excellent high- and low-temperature impact performance, usually withstands 200 hours.
6. Excellent adhesion and anti-cracking properties.
7. Low water absorption, good water and moisture resistance.


 
Typical Applications

 
1. Applicable to the sample parts that need full enclosed protection, such as transformer, electronic stator, ignition coil, etc.
2. Suitable for motors, automotive electronics, power tools, reactors, instruments, and other encapsulation protection, with excellent adhesion and temperature resistance to most plastic and metal substrates.

 
Se685 25kg 100: 15 2K Epoxy Potting Adhesive for Automotive Electronic Module
Se685 25kg 100: 15 2K Epoxy Potting Adhesive for Automotive Electronic Module
 


 
Technical Data Sheet

Se685 25kg 100: 15 2K Epoxy Potting Adhesive for Automotive Electronic Module
 
Specification of Part-A (resin)
Items Standard Specification Typical value
Color Visual Black Black
Viscosity (mPa.s) GB/T 2794 20000-10000 140000
Density (g/cm3) GB/T 13354 1.7 ± 0.1 1.74
 

Se685 25kg 100: 15 2K Epoxy Potting Adhesive for Automotive Electronic Module
 
Specification of Part-B (hardener)
Items Standard Specification Typical value
Color Visual Transparent Transparent
Viscosity (mPa.s) GB/T 2794 200±100 175
Density (g/cm3) GB/T 13354 1.0 ± 0.1 0.98
Specification after mixture
Items Standard Specification Typical value
Mixing ratio Volume ratio A:B=100:15 100:15
Color Visual Black Black
Viscosity (mPa.s) GB/T 2794 2000±1000 1700
Density (g/cm3) GB/T 13354 1.35 ± 0.1 1.36
Pot life (min) / 50± 10 40
Gel time  25ºC/H -- 2-3 2H/20min
Curing speed Pour 230g in a plastic cup/Room temperature 25ºC/H 24
Pour 230g in a plastic cup
/Heat curing
70ºC/2H Fully cured

Se685 25kg 100: 15 2K Epoxy Potting Adhesive for Automotive Electronic Module
 
Specification after cured
Items Standard Specification Typical value
Hardness (Shore D) GB/T 531.1 85± 5 85
Dielectric Strength
25ºC,kV/mm
GB/T 1695 >17 18
Dielectric constant
100KHz,25ºC
GB/T 1693 3-5 4
Dielectric Losses 100KHz,25ºC GB/T 1693 0-1 0.2
Tensile shear strength
AI-AI (MPa)
GB/T 7124 ≥12 12.58
Tensile shear strength
Steel & Steel (MPa)
GB/T 7124  12 13
Glass transition temperature Tg (°C) GBT 11998 50-60 55
Coefficient of linear expansion um/m.°C GB/T 20673 -- 38,
115,>Tg
Volume resistivity (Ω·cm) ASTM D 257  1014 3.4×1014
Thermally conductivity (W/m.k) ASTM D 5470 >0.9 0.96
Flame retardant (UL-94) ANSI/UL-94 V-0 V-0
Water absorption rate 24H,25ºC, % GB/T 8810 <0.2 0.13
Water absorption rate 24H,100ºC, % Water absorption rate 24H,25ºC, % ≤0.6 0.6
Thermal shock test -40ºC-+150ºC 500 times Excellent
Service temperature (ºC) / -40 ~ +150 /
Note: The above typical values were all detected at 25 ºC;

 
 
Direction of Applications


Manual mixing process (230g mixing volume)

1. Preheating: AB component in low temperature, the viscosity will become high, it is recommended to preheat to 20 ~ 25 ºC, easy to use.
2. Mixing: proportionally weighing A, and B components, mixing vertical stirring rod, clockwise (or counterclockwise) in the same direction and rapid mixing for 3 minutes, 110-120 Circle/min, pay attention to the bottom of the container, the edge should also be stirred evenly, otherwise there will be a local phenomenon of non-curing.
3. Pouring: pour the mixture into the device (Note: 2-3 minutes to pour the glue on the product), if the device has a complex structure and large volume, it should be poured in stages.

Se685 25kg 100: 15 2K Epoxy Potting Adhesive for Automotive Electronic Module
 
PACKING AND STORAGE
 
Package specification:
 
 
Part A 25 KG /Bucket;
Part B 6 KG /Bucket.



 
 
Storage:

Shelf life: Part A 12 months,
Part B 6 months in unopened packaging in a cool and dry storage place at temperatures between +8ºC to + 28ºC


 
Transportation:
 
moisture-proof, rainproof, sunproof, high-temperature roof, keep away from heat sources, handle with care, and do not squeeze or collide
 
 
Se685 25kg 100: 15 2K Epoxy Potting Adhesive for Automotive Electronic Module
 
Company Profile


Se685 25kg 100: 15 2K Epoxy Potting Adhesive for Automotive Electronic Module


SEPNA focuses on the R&D and production of advanced new materials. Headquartered in Shanghai, the factory is located in Qidong High-tech Zone, Jiangsu Province. It is a modern technology factory with an area of 20000 square meters.

SEPNA factory uses an advanced MES automatic quality control system and a full-process ERP management system for strict quality control. 

Se685 25kg 100: 15 2K Epoxy Potting Adhesive for Automotive Electronic Module




SEPNA factory and products have passed many international system certifications. Such as ISO9001-2015, SGS, 16949, and other certificates.

SEPNA adheres to the values of being "customer-centrictake technologas the blood, and focus on high-quality", adheres to the development concept of "DEVELOP DEPEND ON THE TECHNICAL INNOVATION, LIVE to DEPEND ON THE QUALITY,"; 
Focus on providing customers with more accurate and safe products with "bonding, sealing, and protection" functions.

Se685 25kg 100: 15 2K Epoxy Potting Adhesive for Automotive Electronic Module


SEPNA product lines, from flexible sealing, and fixed bonding to the development of multiple curing forms products,  Can fully match the production and manufacturing processes of different customers, and SEPNA can provide all customers with more options, higher efficiency, and better quality product solutions, as well as omnidirectional customized services and support.

 

SEPNA closely connects customers/suppliers/employees/partners with the mission of "Zero SL Bonds Us Together! ". And continues to promote technology and product innovation, service innovation, and talent innovationbetter combine the value of products, services, and talents to make products more perfect, make industrial manufacturing more efficient, and provide more valuable products and service solutions for the high-end and high-end manufacturing industry!

 

Se685 25kg 100: 15 2K Epoxy Potting Adhesive for Automotive Electronic Module
Se685 25kg 100: 15 2K Epoxy Potting Adhesive for Automotive Electronic Module
Se685 25kg 100: 15 2K Epoxy Potting Adhesive for Automotive Electronic Module
 
Why Choose Us



Se685 25kg 100: 15 2K Epoxy Potting Adhesive for Automotive Electronic Module


1. Outstanding manufacturers and powerful factories.
2. OEM / ODM AVAILABLE (Professional design team providing package design solutions for OEM / ODM customers free of charge.
3. Free Samples.
4. Imported Raw Materials and Test Equipment.
5. Strict quality control (We have passed GB/T 19001-2016, IS09001:2015, and IATF 16949:2016 quality system authentication, and we can provide ROHS/SGS/ MSDS certification of products).


Se685 25kg 100: 15 2K Epoxy Potting Adhesive for Automotive Electronic Module

6. Deliver in 7-15 Days after payment.
7. Excellent QC Team and R&D Team.
8. Provide professional application technology solutions.
9. Complete the after-sales service system.
10. Partners with Top 500 Global Companies.

Sepna's products have been widely used in the international market, mainly in North America, South America, Asia, Southeast Asia the Middle East, Oceania, etc.

Until now, she has serviced nearly 1000 enterprises all over the world.
 

Se685 25kg 100: 15 2K Epoxy Potting Adhesive for Automotive Electronic Module


Se685 25kg 100: 15 2K Epoxy Potting Adhesive for Automotive Electronic Module


 
Our customers and Exhibition


Se685 25kg 100: 15 2K Epoxy Potting Adhesive for Automotive Electronic Module
 
Certification


Se685 25kg 100: 15 2K Epoxy Potting Adhesive for Automotive Electronic Module
 
About Transportation


Samples: Express ( FedEx, DHL, TNT, UPS, etc.)
Cargo:      By Sea ( FCL / LCL), By Air, By Railway, By truck, etc.

Se685 25kg 100: 15 2K Epoxy Potting Adhesive for Automotive Electronic Module
FAQ:


Q1. How to get an accurate quotation from us?
A1. 
Please provide your requirements, product specifications, quantity, and trade terms. 


Q2. Can you provide OEM service?
A2.Yes.Private labeling service is available

Q3. How to be SEPNA'S distributor?
A3.
As the growing of Sepna's global business, we need to find more and more distributors and agents
worldwide. SEPNA will provide the best solution and service for our partners.

For more information, pls contact our salesperson or call us:+86-400-882-1323

Q4. Can I get a sample?
A4. Yes. We offer free samples

Q5. What is your product's shelf life?
A5.9 months when stored in cool dry and well-ventilated areas under 25ºC.




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