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One Component Solder Welds in The Body Joint High Temperature Curing Bonding Sealant for Clean Electrophoresis Metal or Electrocoat Prior to Powder Coat

Name: One Component Solder Welds in The Body Joint High Temperature Curing Bonding Sealant for Clean Electrophoresis Metal or Electrocoat Prior to Powder Coat
Brand: Shanghai Sepna Chemical Technology Co., Ltd.
SKU: DJxYKGiUOqkj
Price: 4.15 USD
Availability: InStock

One Component Solder Welds in The Body Joint High Temperature Curing Bonding Sealant for Clean Electrophoresis Metal or Electrocoat Prior to Powder Coat pictures & photos

CAS No.:	9009-54-5
Formula:	CH3h8n2o
EINECS:	210-898-8
Bonding Function:	High Temperature Resistant Adhesive
Morphology:	Paste
Application:	Automobile, Construction

Samples:	US$ 0/piece 1 piece(Min.Order) \| Request Sample

Customization:	Available \| Customized Request

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