Customization: | Available |
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CAS No.: | 9009-54-5 |
EINECS: | 210-898-8 |
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S855 is a one component, heat-curing adhesive and sealant based on flexible epoxy resin. As a sealant, it is especially designed for sealing on E-coated surfaces prior to a paint or powder-coating process.
Key Features:
1.Adheres well to most E-coated substrates and to oily metal substrates.
2.Suitable for powder-coating processes.
3.High temperature resistance of 160-220 ºC(320-430°F), no aging and discoloration.
4.Spot welding still possible.
5.Does not contain solvents or PVC.
Typical Applications:
S855 is designed as an adhesive / sealant. As an adhesive, it is usually used in combination with spot welding, riveting, clinching and other mechanical fastening techniques to fix the parts until the curing process is completed. Bonding of oily substrates is possible up to an oil amount of 3 g/m2. Due to the wide variety of oils, tests with original substrates and conditions are mandatory.
S855 is also well suited for sealing applications on E-coated metals prior to subsequent paint processes (including powder coating processes).
Packing and Storage:
Shelf life: 9 months
Keep away from heat and direct sunlight.
Store between 5°C and 25°C (41°F and 77°F)
Package specification:
400ml/cartridge, 20 cartridge/ box
230kg/ bucket.
PROPERTY | STANDARD | VALUE-S855 |
Appearance | Visual | White, homogeneous paste |
Odor | - | Slight |
Density/g/cm3 | GB 13477.2-2002 | 1.50±0.1 |
Solid content | -- | >97% |
Shore D hardness | GB/T 531.1-2008 | 50±5 |
Curing time | At 180°C (355°F) substrate temperature |
30min |
Tensile strength / Mpa | GB/T 528-2009 | 4.5 |
Elongation at break | GB/T 528-2009 | 80% |
Shear strength / MPa (thickness 2mm) |
GB/T 7124-2008 | >2.5 |
Glass transition temperature Tg | GB/T 11998-1989 | 50 |
Service temperature | / | -40°C - 90°C (-40 - 195°F) |