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Low Strength and Removable Two-Component Thermally Conductive Silicone Gap Filler Bonding of Battery Modules to Liquid Cooling Plates
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US $0.10-5.28
/ Piece
|
2 Pieces
(Min. Order)
CAS No.:
9009-54-5
Formula:
CH3h8n2o
EINECS:
210-898-8
Bonding Function:
Structural Adhesive
Application:
Automobile, Construction, Energy Storage Industry
Material:
Silicone
Samples:
US$ 0.1/kg
1 kg(Min.Order)
|
Request Sample
Customization:
Available
|
Customized Request
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